• Proven Performance and Reliability for Research, Industrial and Military Applications 
• High-Sensitivity Indium Galium Arsenide (InGaAs) Detectors 
• Mid and Large Formats with Common Electrical Interfaces 
• User-Configurable, Multiple Packaging Options 
• Industry Standard Devices 

FLIR Systems Inc., the premier supplier of infrared products, introduces the “Core by Indigo” line of Indium Galium Arsenide (InGaAs) components. These commercial off-the-shelf staring focal plane arrays (FPAs) and detector dewar cooler assemblies (DDCAs) are based on our InGaAs detectors and advanced readout integrated circuit (ROIC) technology. 

Core by Indigo” FPAs and sensor assemblies are available in mid and large format, including 320 x 256 and 640 x 512 pixel arrays. Short-wave InGaAs FPAs cover the 0.9 to 1.7 µm spectral range. A VisGaAs option is also available for sensitivity in the visible and near infrared down to 0.6 µm. FPAs are hybrid assemblies that are mounted on 84-pin leadless chip carriers, customer supplied substrates, or integrated into packaged sensor assemblies.


These arrays utilize a capacitive transimpedance amplifier circuit design, optimized for a wide range of applications, including those with low signal levels. All designs include two operation modes — a simplified default mode and a user configurable command mode — which provide the flexibility necessary to support a wide range of applications. From terrestrial applications that use a single channel video rate output, to high-speed scientific laser testing where multiple outputs and dynamic windowing are needed — FLIR focal plane arrays surpass the requirements. The windowing feature allows two-dimensional sub-arrays to be read out at frame rates of up to 38,000 frames per second for small window sizes. Other advanced on-chip features of the ROIC include integration capacitor selection, variable gain, multiple output channels, snapshot integration with variable integration time settings, signal skimming, non-destructive readout, and dynamic image transposition. The detector bias setting and overall power control for the chip are also user-adjustable. 

Focal plane arrays are typically packaged in 84-pin leadless chip carriers and are wire-bonded and fully tested to meet the listed specifications. A wire-bonding diagram and interface documentation are delivered as part of the standard product offering. Volume customers have the option of supplying their own substrates for FPA mounting, conditional on advance approval. 

Sensor assembly packaging is available for both mid and large format InGaAs FPAs. These assemblies consist of one FPA mounted on a thermoelectric cooler (TEC) and are integrated into a FLIR designed dewar, which is powered through pins on the rear side of the assembly. The system f-number is set by the higher level system optical path. The front window of the dewar is BK7A glass and transmits radiation in the 0.9 to 1.7 µm range; it is canted and coated for minimizing reflections. The window and package opening are sized so as not to vignette the FPA when used with f/1.4 or slower optics. The average window transmittance (at 1.0 µm) is greater than 99%, with less than 0.1% reflectance at 1.55 µm. 

The back of the mid format ISC9809 package supplies the 41-pin electrical interface to the assembly; on the large format ISC0002 assembly the electrical interface is 28 pins on two sides of the package. An interface description document describes this interface and is provided as part of standard delivery.